In PCB manufacture industry, the layer of chemical plating usually is thickened through
an acid copper plating process. Furthermore, throwing power and covering
power of the bath are sensitive to organic impurities and various metal impurities.
It is possible to avoid taking them into the bath if the copper sulfate is high
purity.

Therefore, problems such as pits, marks, darkness and mist become easy to forestall
in order to guarantee a well-proportioned surface and plating capacity to deep
and small holes. Moreover, it helps to improve the ductility of the board and
the strength for resisting haul.

Composition(%):
purity: 99 (min.)
Cu: 25.35
As: 0.002 (max.)
Hg: 0.0001 (max.)
Fe: 0.003
Zn: 0.0012
Cl: 0.003
Pb: 0.0012
Al: 0.001 (max.)
Ni: 0.001 (max.)
PH: 3.5 - 4.5